Solutions for Sample Preparation
Enabling your Physical analysis:
Package opening, Cross section, Backside Silicon access, Metrology, Delayering
Sample preparation for failure analysis & counterfeit study is required in many different ways:
Providing flexibility to address your needs & challenges
Here are reviews of challenges & solutions regarding :
Package Opening - Decapsulation
Package opening or de-capsulation need flexibility to address the different package and materials. In addition, it requires new capabilities to address new technologies, for instance to address de-capsulation without damaging copper wine.
Sector Technologies offer a complementary suite for wet package opening from Nisene’s technology.
- JetEtch for acid de-capsulation – with the latest JetEtch Pro, it is the most suitable solution for your latest IC and selectivity you require.
- New! JetEtch with Copper Protection - the lastest JetEtch Pro Cu Protect, introduce unique & efficient technologies that does not require laser pre-opening.
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Multi layer die showing second bond exposure (JetEtch) |
Bond pad view after chemical opening (JetEtch) | Copper wires after JetEtch Pro Cu Protect opening |
Copper wires after JetEtch Pro Cu Protect opening |
Sector Technologies is also offering Laser Pre-opening solution
- LRay is best cost efficient solution for pre-opening of IC package, including ceramics... Its new fiber laser technology enable best economical & reliable choice - with Decap 10 table top solution or the flexible Decap 20 solution.
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Laser dry Pre-opening of IC Package |
Backside silicon access
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LACE trench on the silicon backside allowing FIB edit on the floor of the trench |
More and more solutions requires a clean access to the backside silicon: FIB backside, all emission microscope solution (see our EFA tool), as well as physical access t
o flip-chip. Localize silicon access is required for instance as soon as you need to preserve electrical capabilities, whereas polishing is thinning full die.
Challenge is to enable a clean and fast localised access through Silicon.
Sector Technologies solution, thanks to our partner Varioscale, enable quick clean access for your analysis.
- Check the unique LACE (Laser Assisted Chemical Etching) product available in the market. Providing sample preparation solution scaling between "decapsulation" & "FIB".
- 50x faster than FIB
- Clean Etch: turning Silicon in vapor (i.e. no particle being generated).
- Precise Etch as close as <1µm to the active area - enabling probing. Solution includes in-situ metrology technology.
- With additional large scale deposition flexibility
Metrologie solutions
Newest technologies need a tighter control on dimension:
- EFA backside techniques are using SIL (Solid Immersion Lenses), where backside thickness need to be controled
- MEMS reliability is impacted by warping
- MEMS access need as well controls - at the expense/ risk of getting through cavities
- FIB backside need to be prepare with some silicion
Any ellipsometer may not be appropriate to accomodate your different silicon doping/ surface condition.
Sector Technologies offer, thanks to our partner Varioscale, metrology solution, enabling through silicon & oxide.
- To efficiently control of your backside Silicon thickness, regardless of the surface condition/ Silicon doping
- For more information on VarioMetric (VMT) or VarioProfile (VMP) solution