Lray
Decap 10 & Decap 20 fiber laser solution
Fiber Laser for IC decapsulation & cross-sectionning
Why Laser for IC Decapsulation
Laser is a dry solution to:
- pre-open IC package
- support ceramic package opening
- MEMS cap removal
- support specific "fine" cross-sectionning
New Fiber Laser technology provide the most cost economical solution
- Most cost efficient solution
- Most Reliable solution
Fiber Laser light is already coupled into the fiber, providing high optical quality (no thermal distortion). Fiber Laser also provide highest vibrational stability. Fiber laser can be operated maintenance free.
Decap 10 - table top solution
Decap 10 is the full integrated & most cost effective fiber laser solution for IC decap.
Decap 20 - flexible fiber laser solution
Decap 20 fiber laser source & LSK800 frame provide flexible & cost efficient solution for multipurpose usecases/ integrations
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Example of a Decap 20 Fiber Laser solution
Integration of Decap 20 Fiber Laser Source and LSK800 Laser Frame
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Laser |
- Ytterbium fiber laser - Wavelength 1060nm Power /Pulse energy/ frequency - 20W 1mJ 20- 200 kHz - 30W 1mJ 30- 200 kHz - 50W 1mJ 50- 200 kHz - Laser Class 1 (in the frame) – 4 as integration (EN 60825-1) |
| Beam Deflection |
- Galvo scan system - For 10W - 70x70mm - For 20W, 30W, 50W - 100x100mm - Different options -up to 290x290mm |
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| Red Laser | - Supporting Ease of Use - to pilot & focus | |
| Vision | - 10X HD camera with LED lightning | |
| Control |
- Laser Studio SW - Z axis control (130mm) - Option for X-Y stage, rotation, etc... |
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| Frame | - Multiple Frame Option (Size, with more automation or integration potential) | |
| Safety |
- EMO - Safety door - Fume extration set-up (option for fume extraction system) |
Decap 10, Decap 20 and LSK800 are Lray 's Products
