Package Fault Localisation

New Requirements for Advanced packages & Power Devices

Whereas Package Failure Analysis used to be limited to X-Ray inspection or Acoustic Microscopy (for Crack & Delamination), new technologies, for both advanced packages & power devices, have shown requirement for Fault Localisation prior getting to Physical Analysis.

Solution presented are 'Non destructive" fault Localisation solutions

ELITE Enhanced Lock-In Thermography Emission Through Package fault localisation	EOTPR Electro-Optic TeraHertz Pulse Reflectometry
Usecase: Flexible solution with ultimated sensitivity to detect hot spot through package (as well as flexible to silicon or power device application, advanced thermal analysis) Pricinple: Lock-in Thermography support low power heat spot detection through package thanks to its unique InSb camera and optics together with its unique real time lock-in implementation. Key Features: Unique high performance and Flexible implementation supporting multiple usecases.	Usecase: Unique Solution to detect open in packages, as well as other resistive open or shorts Principle: The TeraHertz TDR solution is unique technologie utilizing TeraHerthz wavelenght enabling down to 10µm fault localization Key Features: TeraHertz's optical Low Jitter is enabling this high resolution localisation.