Solutions

• Design & Product Eng
  • Tester for design debug
  • Design Debug on Silicon - timing validation
  • Circuit Edit
• Failure Analysis PACKAGE
  • Package
    • Localization
    • Vizualization
  • MEMS
• Failure Analysis SILICON
  • Electrical Failure Analysis
  • Electrical Characterization
  • Design Debug
  • Circuit Edit
• Laboratory solutions
  • Sample Preparation
    • Package opening
    • Delayering
    • Backside Silicon Access
    • Metrology
  • Optical Systems
  • R&D lab components
• Specific Applications
  • Security & Counterfeit

Products

• Teseda Testers
  • Tester HW & SW
  • NetXY
• Fault localization
  • Meridian IV
  • Elite
  • Waferscan
  • Trivision
  • LVx Option
  • Teraview EOTPR
• Xray 3D tomography
  • MicroXCT-400
  • MicroXCT-200
  • VersaXRM-500
  • UltraXRM-L200
• NanoProbing
  • nProber
  • dProber
  • sProber
• Package opening
  • JetEtch
  • FA-LIT
• Circuit Edit - FIB
  • OPTIFIB IV
  • P3X IV
• Design Debug
  • Emiscope
  • RUBY
  • LVx option
• Metrology
  • VarioMetric
  • VarioProfile
• Delayering - Gel Etch
• Counterfeit Detection Truview
• Silicon Access - LACE
• Optics & Imaging
  • IR lenses for EMMI

Company

• Activities
• Support
• News/ Events/ Networks
• Contacts
• Publications