Versatile Electrical Failure Analysis

Spatial defect localization requires an easy-to-use integrated emission and laser scanning microscopy platform.
TriVision is a fully integrated electrical failure analysis platform industry-leading sensitivity for fault and defect localization. TriVision is the preferred choice for developers of advanced semiconductor devices who need a cost-effective, scalable platform designed to easily expand in step with future technology roadmaps.
Failure analysis has become increasingly complex and demanding not only from a technological standpoint, but also because of the aggressive turnaround times required for competitiveness in today's marketplace. From state-of-the-art first silicon design validation to quickly addressing key customer returns, the TriVision electrical failure analysis platform enables companies to successfully achieve time-to-market and profitability goals.

Trivision system is a flexible 'down-looking' solution integretating 3 of the following options:

  • CCD - for navigation through the Silicon back-side
  • LSM - for imaging and laser stimulation technique
  • InGaAs - for light Emission Microscopy ( EMMI)
  • MCT - for light Emission Microscopy/ Thermal detection

 

 


Trivision is a DCG Systems solution



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