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EmiScope IIIt

Timing Analysis using Time-Resolved Emission

Timing analysis of sub-32nm technology presents new debug and failure analysis challenges for design verification engineers. Tight geometries and lower voltages also result in increasingly complex chip navigation and the need for new probing technologies. The EmiScope IIIt is a completely non-invasive IC diagnostic platform for design debug and failure analysis.

Patented Non-invasive, time-resolved emission ( TRE) technology

  • Providing sub-picosecond timing and logic measurements (US Patent 7,224,828)

Extendable path to 32nm needs

  • Solid-immersion lens option provides < 0.25 µm optical resolution (US Patent 7,227,702)
  • A variety of optional lens sets allow analysis of both wirebond and flipchip circuits
  • Your current system can be upgraded

Extendable to other Lab needs or applications
  • Upgradeable to LSM applications for complex device analysis Flexible fixturing Optional software data analysis modules
  • LVx option available
  • The Emiscope IIIt has an array of optional lens kits available for a variety of applications

Time Resolved Emission (TRE)

State-of-the-art photon detection technology allows the EmiScope to measure logical switching activity and timing information with sub-picosecond accuracy from virtually any active transistor in both flip-chip and wirebond devices. The innovative time-resolved photon emission detection technology enables semiconductor manufacturers to perform debug and characterization more quickly and effectively, thus bringing products to market faster, with fewer design respins.TRE

Debug of flip-chip packaged and multi-metal layer devices. Built on the hardware and software foundation of the award-winning EmiScope-II, the EmiScope-IIIt adds configuration flexibility while maintaining ease-of-use.

The EmiScope's high bandwidth and short acquisition times allow engineers to collect as much-or as little-information as they need to solve problems quickly. The system's high-bandwidth electronics, high-resolution imaging, and data management capabilities enable semiconductor manufacturers to perform timely design debug, failure analysis, and characterization.

Extendable to 32nm needs & new applications

The patented solid immersion lens ( SIL) option delivers three times the resolution of traditional air-coupled lenses, allowing more precise device navigation and improved signal waveform measurements. The SIL provides five times the signal acquisition rate compared to traditional lens, enabling fast measurements of sub-1.0 volt devices and it provides solutions to achieve <0.25 µm optical resolution.

A "long-working distance" SIL (LWD-SIL) brings solid-immersion lens resolution and performance to devices in wirebond packaging and board-level applications.

Patented Spray Cooling technology is available for probing high-power devices. This unique method of heat dissipation is available on EmiScope and Ruby.

Both wirebond and flipchip devices can be probed using a variety of user-swappable lens sets-including five lens sets for a variety of package types. The EmiScope-IIIt is upgradeable with Laser Scanning Microscope (LSM) technology. Designers and failure analysis engineers can trace through circuits inside actual silicon.

LVx option is also available on EmiScope-IIIt

 

EmiScope-IIIt is a DCG Systems solution



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