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Yield improvement solutions employing emission-based analysis, Dynamic Fault Imaging and Static Fault Imaging for both packaged parts and wafers |
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Solutions for circuit modification |
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Solutions for non-contact probing of integrated circuits. |
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Solutions for electrical characterization for process integration and failure analysis |
Nprober Dprober Sprober |
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Solutions for correlation to design analysis – from all Fault isolation, Circuit Edit & Design debug solutions |
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Solutions for non destructive fault identification in package |
MicroXcT400, 200 |
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Solutions for sample preparation and MEMS characterization |
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Silicon access – LACE Solutions for clean & fast silicon/ glass opening (prio FIB, etc…) |
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Solutions to enhance of your optical plateforms & bench. |
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