MEMS characterization

Solution to see “THROUGH” the MEMS

Similarly that MEMS quality & reliability can not be considered simply like IC, since there are mechanical & new processed (packaging/ cavities), analysis is critical to adapt to such specificities.

Cavities protect MEMS Mechanism

Compare to standard semiconductor processes, there are specific MEMS challenges, mainly related to sensitive packaging & “cavities”.

• Packaging: Mechanical parts of the MEMS needs to be protected by a cavity.
  • Check for more info MEMS packaging/ failure mechanisms
• MEMS mechanical: despite the variety of MEMS techniques, removing sacrificial oxide leads to cavity
  • Check for example of MEMS failure mechanisms

Example of MEMS encapsulation & package | Example of MEMS mechanical part

Control techniques need to see “THROUGH”

Why is it important?

MEMS failure mechanism are hidden either by cavity or package. Inline control are limited to 'visible' fault.

• (1) MEMS can fail, (2) package can cause failure, or (3) package can cause unstable functionality/ reliability … A close cavity or package is not always ensuring protection of mechanical part, so you need to see through it
• MEMS packaging also include connection to the controler component. According to ISTFA 2009, MEMS packaging accounts for 85% of fabrication cost

Sector Technologies offer multiple solutions to support your analysis requirements

• Measurement for your encapsulated MEMS, see through Si and Glass, get easy and fast thickness or profile of the cavity/ MEMS.
  • For examples of our solution – check our usecase – showing how tilt between MEMS and cavities can be assessed

• Ensuring NDT visualization of your MEMS, Full 3D non destructive solution, high resolution solution for large sample
  • For more information – check our usecase - getting beyond 2D limits, and ensuring high-resolution 3D view
  • Check why MEMS’s required best in class 3D Xray CT tomography, don’t just expect an other extension of a  Xray 2D plateform… more information on unique Xradia solutions.

• Identifying electrical failure localization, leakage, and thermal characterization
  • For more information on our electrical fault isolation solution - check ELITE solution for through package fault isolation and thermal characterization