VARIOEDIT

Silicon Access solution

Fast & Clean Access for your backside analysis

Unique LACE (Laser Assisted Chemical Etching) solution

VarioEdit is a Laser Assisted Chemical Etching (LACE) system pioneered for backside circuit edit, laser chemical vapor deposition (LCVD) and laser assisted dielectric deposition.

Improving FIB success Rate & Time to result to the FIB

Applications are numerous such as very fast backside silicon etching, 3-D micromachining of semiconductor and biomaterial devices, Deposition of metal lines and pads.

LACE adds capability and capacity to the Backside Circuit Edit Tool Set

• Can work from full thickness down

  • CNC milling not required

  • Device attached to PCB or has front side capacitors

• Robust to surface contamination

• Low cost of ownership

LACE brings its advantages to any Silicon based devices

• Clean Silicon removal by vaporization: silicon opening without any artifacts linked to sputtered material.
• Deposition of low resistive long metal lines for package

Efficient Technology

• Etch very flat and smooth trenches within a few micrometers of the circuit layers
• Localized trenching is the best method for preserving the electrical, thermal and mechanical integrity of the IC
• Throughput Value
  • Silicon etching 50X faster than chemically assisted (XeF2), high current FIB
  • “off loading” the FIB for higher value processing
  • Platinum deposition of long lines and pads with no overspray

The VarioEdit system is primarily constructed with three building blocks:

• Optical Block—includes a high power laser, beam steering optics and optomechanical components, viewing system and an in-situ thickness monitoring metrology tool.
• Process Chamber—includes sample holder and gas/vacuum handling equipment/fittings
• Precision X-Y-Z stages

VarioEdit is a Varioscale solution